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Cadence Sigrity 2016 for win Sigrity 2016 Portfolio Improves Product Creation Time with PCB Design and Analysis Methodology for Multi-Gigabit Interfaces Cadence expanded its Sigrity™ technology portfolio with new products and capabilities: Upgraded serial link analysis flow Optimized design flows Upgraded 3D interconnect modeling Upgraded serial link analysis flow to accelerate the time to pass compliance tests New IBIS-AMI model building technology takes industry-proven equalization algorithms and provides a wizard-based graphical interface to rapidly facilitate creation of IBIS-AMI models. Available in two tiers, one that enables creation of models strictly for Sigrity tools, and another that creates models suitable for any IBIS-AMI compliant simulator. New cut-and-stitch model extraction technology allows for segmenting long serial links into sections that should be modeled using 3D full-wave and sections that can be modeled using hybrid extraction technology. The resultant model is extracted 10X faster than a strictly 3D full-wave extraction with 95% accuracy. New USB 3.1 (Gen 2) compliance kit to confirm that the 10Gbps interface requirements are met. Sigrity SystemSI™ technology Sigrity PowerSI® technology Sigrity PowerSI 3D EM Extraction Option Optimized design flow between PCB designer and power integrity engineer New cross-probing between DC analysis report file and Allegro® editing canvas Batch DC analysis available directly from the Allegro editing canvas Review previously generated DC analysis report files from the Allegro editing canvas Sigrity PI Base Sigrity PowerDC™ technology Optimized design flow between IC package designer and characterization engineer Batch electrical performance assessment (EPA) available directly from the IC package designer’s editing canvas Batch package model creation using hybrid solver technology directly from the IC package designer’s editing canvas Review previously generated EPA report data from the IC package designer’s editing canvas Sigrity XtractIM™ technology Upgraded 3D interconnect modeling to enable rapid modeling of low-cost PCB and IC packages New rapid and accurate capacitance extraction technology Quickly produce RLCG interconnect models for designs with few (or no) power and ground planes/shapes using new 3D quasi-static extraction technology Sigrity PowerSI 3D EM Extraction Option

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